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Home2009 • Phillips releases PAC6
Phillips releases Intel® Core™2 Duo SBC for rugged CompactPCI
 
INDUSTRY, California (June 3, 2009) Phillips has released the PAC6 single board computer in Industrial Rugged or Conductive Cooled versions. The 6U CompactPCI form factor boards are available with either a 1.5GHz or a 2.16GHz Intel® Core™2 Duo processor. The PAC6 may be configured with up to 4GBytes of DDR2-400 SDRAM.
 
The PAC6 brings the Core™2 Duo’s low 17W power consumption and an abundance of features to rugged computing. The conductive cooled version (conforming to MIL-STD-810F) uses wedge locks and a full board heat sink for extreme shock, vibration and temperature environments.
 
Two PMC sites are provided for I/O and processing expansion. One of the sites also supports x8 PCI Express XMC. An on-board CompactFlash card permits single–slot booting. The PAC6 Industrial Rugged version has two Gigabit Ethernet and two USB 2.0 ports accessible from the front panel in addition to two PMC bezels. Both versions provide two PICMG 2.16 compliant Gb Ethernet ports, two SATA ports, two USB 2.0 ports, VGA video, four COM ports, IDE interface, mouse & keyboard ports, and the I/O of the two PMC sites routed to the backplane.
 
The PAC6-TM rear transition card makes the backplane signals available on standard connectors at the rear of CompactPCI chassis.
 
PAC6 pricing starts at $4,500 and is available now.
 
For further information contact
Greg Campion
Product Manager
(626) 855-4600
 
 
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